FEINMETALL
ViProbe^® II

FEINMETALL ViProbe® II is the next generation of ViProbe®.

ViProbe® II not only includes all the advantages of the ViProbe®, but also offers a significantly increased product lifetime and additional safety features to optimally protect the wafer during the test.

Product lifetime

4× longer, compared to competing vertical contacting technologies

Temperature range

-55°C to 200°C

Maintenance

Best maintainability available on the market

FEINMETALL ViProbe^® II
is suitable for the following materials

Pad

Pillar

Bump

Advantages,
you benefit from

Improved product life

Improve your TCOO with shimming: FEINMETALL's patented feature for maximum product life.

Safe wafer testing

Safety always in focus. The new ViProbe® II safety features guarantee permanently safe testing without damage to the wafer.

Outstanding temperature behavior

ViProbe® II is based on the experience of the ViProbe® already designed for high temperature and offers excellent test characteristics in a wide range of temperature ranges due to an optimized design.

Easy maintenance and service

The innovative "Free Beam Placement" process in combination with the round beam cross-section offers the best maintainability available on the market and thus reduces downtime to a minimum.

Spezifikations of the ViProbe^®II at a glance:

Min pitch of the DUT	Down to 40 μm
Diameter of the contact element	Down to 1.1 mil
Max active area	Up to 105 mm x 105 mm
Capable temperature range	From -55°C to 180°C
Current carrying capability at RT	Up to 800 mA
Contact force at rec. OD	From 2.2 cN to 10.8 cN