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Fine pitch probes with double plunger

Wafer Probe Card with Spring Contact Probes as Contact Elements

In the new FEINMETALL FeinProbe® spring contact probes are used as contact elements instead of buckling beams. This technology is ideal for contacting fine pitches in bump applications, especially for:

  • WLCSP
  • WLAN
  • RF
  • SiP
  • Analog and Mixed-Signal Flip Chip

 

Using spring contact probes has several advantages for contacting chips, because they are independently spring loaded and have a special tip style for creating optimized electrical contacts to the DUT. 

The advantages at a glance

  • Stable and consistent contact resistance
  • Self-adjusting plunger tip
  • High bandwidth of contact elements
  • High ampacity
  • High spring forces
  • Low risk of damaging bumps
  • No additional gold plating of contact probes necessary

 

Specifications

Contact elements X01, X02, X03
Pitch min 350 µm
Contact probe count up to 5 000
Active area up to 60 mm x 60 mm
Temperature range -40°C to +150°C