Wafer 
Probe
Cards

 

 

In the new FEINMETALL FeinProbe^® spring contact probes are used as contact elements instead of buckling beams. This technology is ideal for contacting fine pitches in bump applications, especially for:

• WLCSP
• WLAN
• RF
• SiP
• Analog and Mixed-Signal Flip Chip

 

Using spring contact probes has several advantages for contacting chips, because they are independently spring loaded and have a special tip style for creating optimized electrical contacts to the DUT. 

The advantages at a glance

• Stable and consistent contact resistance
• Self-adjusting plunger tip
• High bandwidth of contact elements
• High ampacity
• High spring forces
• Low risk of damaging bumps
• No additional gold plating of contact probes necessary

 

Specifications

Contact elements	X01, X02, X03
Pitch	min 350 µm
Contact probe count	up to 5 000
Active area	up to 60 mm x 60 mm
Temperature range	-40°C to +150°C