The market needs for contacting semiconductor components are rapidly increasing. Components are smaller and smaller and so are the required contact probes for test engineering. Additionally, the signal frequencies of the test signals are getting higher and higher. Everyone is talking about topics like Wafer Level Chip Scale Packaging (WLCSP). Internet of things (IoT), which is the communication between devices, buildings, vehicles etc. is one of the leading market drivers in the electronics and semiconductor industry.
FEINMETALL reacts on these developments with new fine pitch probes. These probes are so small, that they nearly cannot be identified without a magnifying glass. The handling of these tiny probes requires special measures (e.g. for mounting, but also for packaging). Therefore these fine pitch probes will be delivered in fixed packing units of 250 pieces only.
The new fine pitch probes can be easily identified by their order code, starting with FP for "Fine Pitch". The following probes are currently available: