OSP (= Organic Surface Protection) is a protective layer on printed circuit boards, which lies transparent and optically barely visible on the copper. It has a maximum thickness of 0.2 to 0.6 μm and consists of an organic dilution based on substituted imidazoles.
This protective layer is significantly harder than conventional surface finishes, oxide layers or impurities that have to be penetrated for reliable contacting. Therefore, the pointed or sharp-edged tip styles 32, 33, 38 and 43 have proven particularly useful for contacting OSP-coated PCBs.
An additional problem with OSP-coated PCBs results from the chemical behavior of this coating: contact with gold leads to a chemical reaction that decomposes gold in the long term. Contacting with gold-plated contact pins is therefore only recommended to a limited extent.
Contact probes of the "Progressive Series" are therefore a very good choice. They allow reliable contacts and long life cycles even in these difficult conditions. In particular, the combination of sharp-edged tip styles with increased preload and the functional "Progressive" coating unique on the market offers the best solution for reliably penetrating OSP coatings.
1. Minimized contamination
The functional "Progressive Coating" is less sensitive to contamination and 3 times harder than gold. This results in a significantly longer life cycle for contacting contaminated surfaces.
2. Improved penetration of contaminations
For a reliable penetration of strong contaminations or viscous layers, special tip styles with an aggressive grind are available. In general, the choice of tip styles is a very important factor for a good contact.
3. Optimized force effect
Very good penetration of contaminations or oxide layers due to a higher preload of the spring. This higher preload leads to an optimized force effect with unchanged nominal force at nominal travel.