For more than twenty years, FEINMETALL's vertical probe card technology, called ViProbe®, has been among the leading test solutions in wafer test. Numerous advantages, such as the stable contact quality of the probe card, the easy replacement of the contact elements and the outstanding temperature stability make this solution the market leader, especially for requirements from the automotive industry.
With the introduction of the next generation - ViProbe®II, short for ViProbe® Long Lifetime - these advantages are complemented by additional mechanisms for life extension and protection of the wafer.
|Minimum test pattern||40 µm|
|Diameter of the contact element||up to 1.1 mil|
|Max surface of test grid||up to 105 mm x 105 mm|
|Max number of contact elements||tens of thousands|
|Covered temperature range||from -55°C to 180°C|
|Current carrying capacity at RT||up to 800 mA continuous, pulsed on request|
|Contact force at recommended overdrive||from 2.2 cN to 10.8 cN|