FEINMETALL MEMS probe cards are using latest production processes to obtain the solid MEMS beams used for contacting even smallest pitches in high-current applications. Compatibility with our well-established probe card setup is thereby guaranteed and ensures a reliable functionality. It is the optimal addition to our product range, especially developed to contact small pitch copper pillars and aluminum pads.
|Min pitch of the DUT||Down to 50 μm|
|Diameter of the contact element||Down to 1.2 mil (equivalent)|
|Max active area||Up to 105 mm x 105 mm|
|Capable temperature range||From -55°C to 200°C|
|Current carrying capability at RT||Up to 1170 mA|
|Contact force at rec. OD||From 1.4 cN to 4.2 cN|
CiProbe® - E Type
The CiProbe® E-type is designed for solder bump wafer test applications with minimum bump pitch 250 μm. An advanced contact element alloy allows to increase the current carrying capability up to 3 A per probe. The CiProbe® is capable of probing grid array, single and multi-DUT layout applications.