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An overview of our probe cards and further information can be found in our brochure Wafer Probe Cards.
Adaptable to an enormous range of applications, the ViProbe® is a proven buckling beam technology.
New version of vertical contact technology with focus on increased service life an other advantages.
Probe card with lamella contact elements, especially suitable for RF applications with a high design variety.
Contacting WLCSP, SiP or flip-chip wafers requires probe cards that can withstand high currents while ensuring high signal integrity.
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Smart solutions for position detection: contact probes with built-in switching function in a wide variety, also with multiple switch points.
The perfect solution: realization of low-wear, detachable electrical contacts in products.
Practical contacts for test module construction: threaded probes, step probes and push back probes for connector testing.
Wide range of variants: contact probes for all common pitches and innovative technology for difficult conditions.
Contacting of all common RF connectors: For frequencies up to 20 GHz, with smart design for highest reliability with easy mounting.
Flexible and proven: Smart solutions for safe transmission of the highest currents in the tightest spaces, for battery testing and e-mobility.
At the limit of what is possible: Reliable contact probes for finest structures and semiconductor contacts down to 40μm pitch.
Four-pole measurement at minimum space: coaxial contact probes with inner conductor as sense pin, from smallest pitches up to highest currents.
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Find the ultimate contact probe portfolio in the FEINMETALL product finder
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The ultimate contact probe portfolio can be found in the FEINMETALL product finder.
The ultimate contact probe and probe card portfolio can be found in the FEINMETALL product finder.
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