ViProbe® II

FEINMETALL ViProbe® II is the next generation of ViProbe®.

ViProbe® II not only includes all the advantages of the ViProbe®, but also offers a significantly increased product lifetime and additional safety features to optimally protect the wafer during the test.

Product lifetime

4× longer, compared to competing vertical contacting technologies

Temperature range

-55°C to 200°C


Best maintainability available on the market

is suitable for the following materials




you benefit from

Improved product life

Improve your TCOO with shimming: FEINMETALL's patented feature for maximum product life.

Safe wafer testing

Safety always in focus. The new ViProbe® II safety features guarantee permanently safe testing without damage to the wafer.

Outstanding temperature behavior

ViProbe® II is based on the experience of the ViProbe® already designed for high temperature and offers excellent test characteristics in a wide range of temperature ranges due to an optimized design.

Easy maintenance and service

The innovative "Free Beam Placement" process in combination with the round beam cross-section offers the best maintainability available on the market and thus reduces downtime to a minimum.

Spezifikations of the ViProbe®II at a glance:

Min pitch of the DUTDown to 40 μm
Diameter of the contact elementDown to 1.1 mil
Max active areaUp to 105 mm x 105 mm
Capable temperature rangeFrom -55°C to 180°C
Current carrying capability at RTUp to 800 mA
Contact force at rec. ODFrom 2.2 cN to 10.8 cN

More information

An overview of our probe cards and further information can be found in our brochure Wafer Probe Cards.

Probe Card Types

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