The Mini Bump Probe F10037S030P300HP (item number 1167096) is designed for precise contacting of very small, densely spaced mini bumps on printed circuit boards. Its tip style 37 (4-point crown stepped) with a tip diameter of only 0.3 mm focuses the contact on the individual bump and reduces the risk of touching adjacent structures at the same time. With a pitch of 2.54 mm / 100 mil and 300 cN spring force, F10037S030P300HP combines a compact contact geometry with defined mechanical loading. The continuous-current rating is 5 A. In this P/HP version, Progressive Coating and increased spring preload work together so that F10037S030P300HP is suited to difficult contacting conditions involving OSP, flux residues or contaminated test points.
