FEINMETALL
LiProbe^®

Probe card with Lamella contact elements, especially suitable for RF applications with a high design variety.

Good contacts

Proven and excellent contacting quality

Temperature range

-55°C to 200°C

Maintenance

Best maintainability available on the market

FEINMETALL LiProbe^®
is suitable for the following materials

Pad

Pillar

Bump

Advantages,
you benefit from

In-house production

The LiProbe® is developed and manufactured internally at Feinmetall. This means that, in addition to the standard portfolio, solutions can be realized for any customer requirement.

Safe wafer testing

Safety always in focus. The new LiProbe® safety features guarantee permanently safe testing without damage to the wafer.

Outstanding temperature behavior

The LiProbe® is based on probe concepts of the ViProbe® and serves high temperature applications almost to the same extent.

Easy maintenance and service

The innovative "Free Beam Placement" process in combination with the round beam cross-section offers the best maintainability available on the market and thus reduces downtime to a minimum.

Best RF performance

LiProbe® offers solutions for RF applications up to 100 GHz using special high frequency modifications.

Specifications of the LiProbe® at a glance:

Min pitch of the DUT	Down to 80 μm
Max active area	Up to 105 mm x 105 mm
Capable temperature range	From -55°C to 180°C
Current carrying capability at RT	Up to 900 mA
Contact force at rec. OD	From 2.8 cN to 5.4 cN
Bandwidth analog @ -1dB limit	Up to 30 GHz