Datos técnicos
| General | |
|---|---|
| Estructura | Double Plunger Probe |
| Tipo/Familia | FP-D |
| Paso (mm/mil) | 0,80 / 31 |
| Temperatura | -45°C...+150°C |
| Dimensiones | |
|---|---|
| Longitud total (mm) | 5.7 |
| Altura sobresaliente (mm) | 1.1 |
| Diámetro del estilo de punta (mm) | 0.35 |
| Diámetro del casquillo (mm) | 0.65 |
| Diámetro del estilo de punta (mm) 2 | 0.35 |
| Materiales y superficies | |
|---|---|
| Estilo de punta | 29 |
| Estilo de punta 2 | 01 |
| Material del émbolo | Beryllium copper |
| Recubrimiento del émbolo | Gold |
| Material del casquillo | Bronze |
| Recubrimiento del casquillo | Gold |
| Material del resorte | High-grade steel |
| Recubrimiento del resorte | Gold |
| Material del émbolo 2 | Beryllium copper |
| Recubrimiento del émbolo 2 | Gold |
| Especificaciones mecánicas | |
|---|---|
| Precarga (cN) | 7 |
| Fuerza del resorte (cN) | 30 |
| Recorrido nominal (mm) | 0.65 |
| Recorrido máximo (mm) | 0.85 |
| Especificaciones eléctricas | |
|---|---|
| Corriente continua (A) | 4 |
| Resistencia de contacto típica (mΩ) | 50 |
Gráficos
Beschreibung des Produkts
The Fine Pitch Double Plunger Probe FP650D2901B035G030L057 (item number 1131051) is designed for precise contacting where installation space is limited. Tip style 29 (4-point crown) targets FP650D2901B035G030L057 at solder bumps and pads; Fine Pitch Probes are used, among other applications, in semiconductor final test, WLCSP solutions, MEMS and micro-PCB testing. In FP650D2901B035G030L057, the double-plunger design provides spring-loaded contacting on both sides and can compensate for mechanical tolerances in compact interfaces. Key design data for FP650D2901B035G030L057 includes pitch 0.8 mm / 31 mil, spring force 30 cN, continuous current 4 A.