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F05037B028P200HP Perspective 1 F05037B028P200HP Perspective 2

F05037B028P200HP

Número de artículo 1137783

Ficha técnica

Cantidad

Datos técnicos

General
Estructura Basic Contact Probe
Tipo/Familia F050HP
Paso (mm/mil) 1,27 / 50
Temperatura -45°C...+100°C
Definición adicional HP
Dimensiones
Longitud total (mm) 43.2
Altura sobresaliente (mm) 8.1
Diámetro del estilo de punta (mm) 0.28
Diámetro del casquillo (mm) 0.78
Materiales y superficies
Estilo de punta 37
Material del émbolo Beryllium copper
Recubrimiento del émbolo Progressive
Material del casquillo Bronze
Recubrimiento del casquillo Gold
Material del resorte Spring steel
Recubrimiento del resorte Gold
Especificaciones mecánicas
Precarga (cN) 120
Fuerza del resorte (cN) 200
Recorrido nominal (mm) 4.3
Recorrido máximo (mm) 6.4
Precisión de punteo +/- (mm) 0.05
Especificaciones eléctricas
Corriente continua (A) 3
Resistencia de contacto típica (mΩ) 40

Gráficos

F05037B028P200HP Resumen de receptáculos similares F05037B028P200HP Denominación de la familia

Beschreibung des Produkts

The Mini Bump Probe F05037B028P200HP (item number 1137783) is designed for precise contacting of very small, densely spaced mini bumps on printed circuit boards. Its tip style 37 (4-point crown stepped) with a tip diameter of only 0.28 mm focuses the contact on the individual bump and reduces the risk of touching adjacent structures at the same time. With a pitch of 1.27 mm / 50 mil and 200 cN spring force, F05037B028P200HP combines a compact contact geometry with defined mechanical loading. The continuous-current rating is 3 A. In this P/HP version, Progressive Coating and increased spring preload work together so that F05037B028P200HP is suited to difficult contacting conditions involving OSP, flux residues or contaminated test points.