The Mini Bump Probe F05037S028P200HP (item number 1137239) is designed for precise contacting of very small, densely spaced mini bumps on printed circuit boards. Its tip style 37 (4-point crown stepped) with a tip diameter of only 0.28 mm focuses the contact on the individual bump and reduces the risk of touching adjacent structures at the same time. With a pitch of 1.27 mm / 50 mil and 200 cN spring force, F05037S028P200HP combines a compact contact geometry with defined mechanical loading. The continuous-current rating is 3 A. In this P/HP version, Progressive Coating and increased spring preload work together so that F05037S028P200HP is suited to difficult contacting conditions involving OSP, flux residues or contaminated test points.
