技术数据
| 一般信息 | |
|---|---|
| 结构 | Basic Contact Probe |
| 类型/系列 | BP075 |
| 间距（mm/mil） | 1,90 / 75 |
| 温度 | -45°C...+100°C |
| 尺寸 | |
|---|---|
| 总长度 (mm) | 33.1 |
| 突出高度（毫米） | 8.1 |
| 针头直径 (mm) | 0.64 |
| 针管直径 (mm) | 1.02 |
| 材料和表面 | |
|---|---|
| 头型 | 06 |
| 针头材料 | Beryllium copper |
| 针头镀层 | Gold |
| 柱塞材料 | Beryllium copper |
| 柱塞镀层 | Gold |
| 针管材料 | Bronze |
| 针管镀层 | Gold |
| 弹簧材料 | Spring steel |
| 弹簧镀层 | Silver |
| 机械规格 | |
|---|---|
| 预紧力（cN） | 80 |
| 弹力 (cN) | 200 |
| 标准行程 (mm) | 4.3 |
| 最大行程 (mm) | 6.4 |
| 定位精度 +/- (mm) | 0.08 |
图形
Beschreibung des Produkts
The Bead Probe BP07506B064G200 (item number 1170174) was developed specifically for contacting solder beads on printed circuit boards. Its tip style 06 (Serrated stepped) with a 0.64 mm tip diameter is matched to small solder-bead geometries and provides targeted contacting without unnecessarily loading the surrounding PCB track. BP07506B064G200 is specified with a pitch of 1.90 mm / 75 mil, 200 cN spring force and 4.3 mm nominal travel. The Beryllium copper plunger of BP07506B064G200 is gold-plated.