Technical data
| General | |
|---|---|
| Structure | Double Plunger Probe |
| Type/family | FP-D |
| Pitch (mm/mil) | 0,75 / 30 |
| Temperature | -45°C...+200°C |
| Additional definition | HS1 |
| Dimensions | |
|---|---|
| Total length (mm) | 5.9 |
| Protrusion height (mm) | 0.8 |
| Tip style diameter (mm) | 0.3 |
| Barrel diameter (mm) | 0.58 |
| Tip style diameter (mm) 2 | 0.3 |
| Materials and surfaces | |
|---|---|
| Tip style | 29 |
| Tip style 2 | 03 |
| Plunger material | Beryllium copper |
| Plunger plating | Gold |
| Barrel material | Bronze |
| Barrel plating | Gold |
| Spring material | High-grade steel |
| Spring plating | Gold |
| Plunger material 2 | Beryllium copper |
| Plunger plating 2 | Gold |
| Mechanical specifications | |
|---|---|
| Preload (cN) | 30 |
| Spring force (cN) | 60 |
| Nominal travel (mm) | 0.5 |
| Maximum travel (mm) | 0.6 |
| Pointing accuracy +/- (mm) | 0.09 |
| Electrical specifications | |
|---|---|
| Continuous current (A) | 3.5 |
| Typical contact resistance (mOhm) | 50 |
Graphics
Beschreibung des Produkts
The Fine Pitch Double Plunger Probe FP580D2903B030G060L059HS1 (item number 1025408) is designed for precise contacting where installation space is limited. Tip style 29 (4-point crown) targets FP580D2903B030G060L059HS1 at solder bumps and pads; Fine Pitch Probes are used, among other applications, in semiconductor final test, WLCSP solutions, MEMS and micro-PCB testing. In FP580D2903B030G060L059HS1, the double-plunger design provides spring-loaded contacting on both sides and can compensate for mechanical tolerances in compact interfaces. Key design data for FP580D2903B030G060L059HS1 includes pitch 0.75 mm / 30 mil, spring force 60 cN, continuous current 3.5 A.