Our portfolio
We provide leading technological solutions including comprehensive support – for flexible solutions with added value.
These Probe Cards can adapt to an enormous range of applications and pad materials. It’s no surprise they’ve been the market’s ideal vertical solution for many years, valued particularly for their unique ease of repair.
The ViProbe®II takes all the benefits of the ViProbe® to the next level, with more options for extending life time and various safety functions for the wafer.
Lamella beams offer a variety of benefits related to RF and power requirements. Short lengths and flexibility in the number of lamella beams make these the perfect solution for challenging applications.
Testing WLCSP, SiP, or flip-chip wafers requires contact elements that can withstand high currents while ensuring strong signal integrity. The FEINMETALL FeinProbe® handles these applications with remarkable ease.
Probe Card Service
Solutions that go well beyond the product. Learn more about our Probe Card Service.
