Glossary

Aoi (Automated Optical Inspection) is a camera-based testing method for visual quality control of printed circuit boards and electronic assemblies in the manufacturing process.

Automotive electronics testing refers to the testing of electronic assemblies and systems for use in vehicles.

The Automotive Industry demands the highest quality, safety, and reliable testing technology.

AXI enables non-destructive testing of concealed solder joints, e.g., in BGA components and complex assemblies.

Outer package of a Contact Probe that guides the Plunger and Spring and ensures mechanical stability and defined electrical properties.

Coatings protect Contact Probes and stabilize electrical properties.

Basic Contact Probes form the basis of modular contact solutions in testing technology.

Basic Threaded Probes enable secure and interchangeable contact in the Test Fixture.

Battery Cell Contacting establishes secure electrical contacts during cell testing processes.

Battery Cell Manufacturers require precise testing technology for quality and safety.

Battery Testing for electric mobility and energy storage: testing of characteristic values, thermal behavior, safety, and Lifetime.

BGa Contacting describes the electrical contacting of components with ball grid array connections, in which the contact surfaces are arranged in the form of solder balls on the underside of the component. Due to the fine grid dimensions, this contacting requires high-precision fine-pitch contact probes, exact alignment, and reproducible spring forces in order to achieve reliable measurement results.

Block plating: Surface finishing of a block-shaped component to improve corrosion protection, conductivity, and wear resistance.

Board testing ensures the functionality and electrical properties of printed circuit boards.

Digital test procedure in accordance with the IEEE 1149 standard for testing printed circuit board connections without direct access to test points.

Cell Formation is a key step in the manufacturing process for battery cells. During the manufacturing process, charging and discharging a battery cell forms its basic electrochemical structure.

A connecting element is a mechanical and electrical connecting element between the test system, Test Fixture, and test object. It enables the reliable transmission of signals or currents and ensures mechanical stability.

Flux-proof connection types prevent the ingress of solder and ensure the function and lifetime of contact elements.

Testing connectors for continuity, contact quality, and secure fit.

Electrical resistance at the contact point between the Contact Probe and the Test Point, which affects the quality of the electrical connection.

Threaded probes and Twist Proof Probes are used for Continuity Testing to reliably check for open connections, short circuits, or incorrect wiring.

Maximum current that a contact or connecting element can carry continuously without unacceptable heating.

A crimp connection is a form-fit and force-fit electrical connection that is created by plastically deforming a metallic crimp area around a conductor. It is a technical term from industrial test engineering and is used in automated test processes.

E-Mobility & Pogo Solutions is a business unit of FEINMETALL and bundles solutions for highly reliable contacting applications in the mobility industry.

Electronic Testing is a Business Unit of FEINMETALL and bundles solutions for the precise testing of electronic components, assemblies, and systems.

Spring Contact Probes used to connect components in functional test systems (FCT) for testing electrical functionality under operating conditions.

FEINMETALL test card solution with Spring Contact Probes for precise contacting of bumps on WLCSP, SiP, and flip chip wafers.

Final Testing is the concluding test step to confirm the function, quality, and specification conformity of a product.

Fine Pitch & Interface Solutions is a Business Unit of FEINMETALL. It refers to solution areas for high-precision contacting of very small grids and complex Interfaces. The focus is on reliable contacting concepts for dense assemblies, sensitive test points, and demanding electrical requirements in modern test systems.

Fine Pitch Probe: meaning, use, and technical relevance for reliable testing and contact solutions.

Movable Contact Probe for Flying Probes for flexible testing of individual test points without a fixed needle array.

Flying Probe Testing: Adapterless, flexible printed circuit board testing with sequential contacting of individual test points.

FM Choice is a selection of proven FEINMETALL Contact Probes that are readily available and offer attractive value for money.

Fct (Functional Test): Test procedure for checking the function of electronic assemblies under real operating conditions.

Handler: Automated system in the semiconductor back end that feeds, positions, checks, and sorts components according to test results.

High Current Blocks are connecting elements for test setups that enable safe contacting and testing of high electrical currents.

Contact Probe for the safe transmission of high continuous and Pulse currents with large-area contacting, low transition resistance, and robust design.

High Current Testing refers to test procedures in which high continuous or Pulse currents are transmitted safely and constantly.

ICT Contact Probes are Spring Contact Probes used to make contact with test points on printed circuit boards during In-Circuit Test (ICT).

In-Circuit Test (ICT): Electrical testing method for checking component values and connections on printed circuit boards via defined test points.

The inner/outer spacing determines the packing density of contacts and is crucial for compact Test Fixtures.

An interface refers to a defined interface between the test system, Test Fixture, and test object. It establishes the mechanical and electrical connection and ensures reproducible signal and current transmission.

Technical concepts for stable and durable connection of test systems, Test Fixtures, and test specimens.

A Kelvin Probe is a special Contact Probe for four-wire measurements (Kelvin Measurements) in which the current and voltage lines are routed separately.

FEINMETALL test card solution with MEMS lamella contacts for precise Radio Frequency and High Current Testing.

Micro PCBs are printed circuit boards with very fine conductor tracks and small distances between structures. They are used in highly integrated electronic applications and require particularly precise testing and contact solutions.

Testing of highly integrated printed circuit boards with fine structures using precise contact solutions.

In the Semiconductor Industry, packages protect chips and enable electrical contact via defined connection surfaces such as BGA or QFN.

Circuit Board Testing using ICT and FCT to verify functionality, wiring, and signal quality. Precision test probes and Progressive Series for maximum process reliability.

Pitch is a technical term from electrical testing and contact technology. It has an application in industrial testing environments to clearly describe components, contact parameters, or test characteristics and is a key criterion for reliable and reproducible testing processes.

Coatings improve conductivity, wear resistance, and contact reliability.

Movable element of a Spring Contact Probe that is pressed against the Test Point by Spring force and establishes electrical contact.

Piston coating of Contact Probes reduces contact resistance and wear and increases lifetime and reliability.

A pogo block is a mechanical contact block equipped with a large number of Spring Contact Probes (Pogo Pins).

Plug connection with integrated Spring Contact Probes for reliable, pluggable, and highly repeatable electrical contacts.

The Pogo Tower is a contact assembly with Contact Probes for electrical connection between the tester and the Interface. It ensures precise signal transmission.

Position Testing: Test procedure for checking the correct component position using defined contacts.

Presence Testing is a test procedure used to determine whether a component, contact, or plug-in element is present and correctly positioned.

A Probe Card is a contact unit in test systems that transmits electrical signals between the test system and the device under test.

Front part of a Contact Probe that establishes electrical contact with the Test Point and has a significant influence on contact quality.

Contact Probe with locking mechanism for defined positioning and secure fixation in the Test Fixture.

Push Back Testing checks the function and reliability of locking mechanisms in Push Back Probes or connectors.

Contact Probe for low-loss and impedance-controlled transmission of high-frequency signals.

Testing of assemblies at high frequencies to evaluate signal quality and transmission behavior.

A receptacle is a mechanical component used to guide, hold, or insulate Contact Probes in Test Fixtures or contacting systems. It ensures precise positioning of the Contact Probes and contributes to the mechanical stability and reliable functioning of the entire contacting system.

The business unit develops solutions for wafer, package, and module testing that require the highest precision, Signal integrity, and Repeatability.

Testing sensors for function, accuracy, and reliability—performed with precise Contact Probes.

A test fixture in which electrical components such as microchips (semiconductor back-end) and Sensors are tested. Fine Pitch Probes are installed inside the socket, which make contact with the contact surfaces of these components.

Solar Wafer Testing with specialized busbar contacting for precise measurements, low resistance, and long Lifetime.

A spacer is a mechanical component used to maintain a defined distance between components in Test Fixtures, test systems, and contact solutions. It serves to precisely define installation heights, Pitch, distances, and positions of Contact Probes, Spring Contact Probes, or assemblies. This ensures reproducible contacting and a stable electrical connection in the test setup.

The spade width describes the width of a blade-shaped tip style at the contact tip and determines the size of the contact surface to the Test Point.

Mechanical functional element in Spring Contact Probes that generates the spring force and compensates for tolerances in the Test Fixture.

A Spring Contact Probe consists of a plunger, spring, and barrel and enables reproducible contacting for ICT, FCT, and high-current applications. Variants include switching, Kelvin, and RF designs.

The force with which a Contact Probe is pressed against the Test Point, which affects the quality of the electrical contact.

Spring plating on the spring in the Spring Contact Probe ensures corrosion protection, low friction, and consistent electrical performance.

Contact Probe with plate-shaped geometry for defined and large-area electrical contacting.

Contact Probe with integrated Switch function for simultaneous contacting and status or presence detection.

Mechanical and electrical interface in test systems for reproducible contacting of test specimens via Contact Probes.

Geometric shape of the contact tip of a Contact Probe, which influences contact behavior, penetration depth, and wear.

The tip style plating on a Contact Probe determines the contact behavior at the contact point.

Contact Probe with integrated anti-rotation device for defined alignment and stable contacting in the Test Fixture.

ViProbe®: Vertical test card solution from FEINMETALL for precise wafer testing in the Semiconductor Industry.

ViProbe® II: Vertical FEINMETALL test card solution for wafer testing with high reliability, improved DUT safety, and extended lifetime.

Wafer Testing refers to the electrical testing of semiconductor structures directly on the wafer.

Wire Harness Testing is a Business Unit of FEINMETALL and bundles solutions for the precise testing of cable harnesses.