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F07537S030P300HP Perspective 1 F07537S030P300HP Perspective 2

F07537S030P300HP

Item number 1167099

Technical data sheet

Quantity

Technical data

General
Structure Basic Contact Probe
Type/family F075HP
Pitch (mm/mil) 1,90 / 75
Temperature -45°C...+80°C
Additional definition HP
Dimensions
Total length (mm) 33.1
Protrusion height (mm) 8.2
Tip style diameter (mm) 0.3
Barrel diameter (mm) 1.02
Materials and surfaces
Tip style 37
Plunger material Steel
Plunger plating Progressive
Barrel material Bronze
Barrel plating Gold
Spring material Spring steel
Spring plating Silver
Mechanical specifications
Preload (cN) 160
Spring force (cN) 300
Nominal travel (mm) 4.3
Maximum travel (mm) 6.4
Pointing accuracy +/- (mm) 0.08
Electrical specifications
Continuous current (A) 4
Typical contact resistance (mOhm) 40

Graphics

F07537S030P300HP Family designation

Beschreibung des Produkts

The Mini Bump Probe F07537S030P300HP (item number 1167099) is designed for precise contacting of very small, densely spaced mini bumps on printed circuit boards. Its tip style 37 (4-point crown stepped) with a tip diameter of only 0.3 mm focuses the contact on the individual bump and reduces the risk of touching adjacent structures at the same time. With a pitch of 1.90 mm / 75 mil and 300 cN spring force, F07537S030P300HP combines a compact contact geometry with defined mechanical loading. The continuous-current rating is 4 A. In this P/HP version, Progressive Coating and increased spring preload work together so that F07537S030P300HP is suited to difficult contacting conditions involving OSP, flux residues or contaminated test points.