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F07537B030P200HP Perspective 1 F07537B030P200HP Perspective 2

F07537B030P200HP

Item number 1169773

Technical data sheet

Quantity

Technical data

General
Structure Basic Contact Probe
Type/family F075HP
Pitch (mm/mil) 1,90 / 75
Temperature -45°C...+100°C
Additional definition HP
Dimensions
Total length (mm) 33.1
Protrusion height (mm) 8.2
Tip style diameter (mm) 0.3
Barrel diameter (mm) 1.02
Materials and surfaces
Tip style 37
Plunger material Beryllium copper
Plunger plating Progressive
Barrel material Bronze
Barrel plating Gold
Spring material Spring steel
Spring plating Silver
Mechanical specifications
Preload (cN) 120
Spring force (cN) 200
Nominal travel (mm) 4.3
Maximum travel (mm) 6.4
Pointing accuracy +/- (mm) 0.08
Electrical specifications
Continuous current (A) 4
Typical contact resistance (mOhm) 40

Graphics

F07537B030P200HP Family designation

Beschreibung des Produkts

The Mini Bump Probe F07537B030P200HP (item number 1169773) is designed for precise contacting of very small, densely spaced mini bumps on printed circuit boards. Its tip style 37 (4-point crown stepped) with a tip diameter of only 0.3 mm focuses the contact on the individual bump and reduces the risk of touching adjacent structures at the same time. With a pitch of 1.90 mm / 75 mil and 200 cN spring force, F07537B030P200HP combines a compact contact geometry with defined mechanical loading. The continuous-current rating is 4 A. In this P/HP version, Progressive Coating and increased spring preload work together so that F07537B030P200HP is suited to difficult contacting conditions involving OSP, flux residues or contaminated test points.