BGA Contacting
BGA Contacting describes the electrical contacting of components with ball grid array connections, in which the contact surfaces are arranged in the form of solder balls on the underside of the component. Due to the fine grid dimensions, this contacting requires high-precision Fine Pitch Contact Probes, exact alignment, and reproducible spring forces in order to achieve reliable measurement results.
FAQ
Due to the very small grid spacing and high connection density, BGA Contacting places high demands on precision and repeatability. Precise alignment of the component, uniform spring forces, and the use of high-precision Fine Pitch Contact Probes are crucial to ensure stable and reproducible measurement results.
Fine Pitch Contact Probes are specially designed for extremely small grid dimensions and enable secure contact between the individual solder balls. They ensure a reliable electrical connection even with high signal density and contribute significantly to process reliability and measurement accuracy.
Precisely designed Bga Contacting with short contact paths and stable spring forces supports clean signal transmission and minimizes interference.
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