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Home › Products › Product Finder › ViProbe®
ViProbe® Perspective 1

Semiconductor testing (Wafer Testing) ViProbe®

Proven and reliable, this vertical buckling beam technology has been established in the market for many years and is valued for its unique ease of repair and high adaptability to a wide range of applications and pad materials.

Technical data sheet

Technical data

Specifications
Min. pitch of the test item 56 µm
Minimum diameter of the contact element 1,6 mil
Max. contact area 80 mm x 80 mm
Temperature -55°C...+180°C
Current carrying capacity at room temperature 800 mA
Contact force at recommended delivery 2,4 cN - 10,7 cN
Contact materials
Contact material 1 Gold
Contact material 2 Palladium
Contact material 3 Diverse
Contact material 4 Solder ball
Contact material 5 Aluminium
Contact material 6 Copper

Probe Card Service

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