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Semiconductor testing (Wafer Testing)


Customizable to an enormous range of applications and probing materials it is the vertical solution in the market for many years and especially appreciated for its unique simple reparability.

Technical data

Min. pitch of the DUT 56 µm
Min. diameter of the plunger 1,6 mil
Max. contact surface 80 mm x 80 mm
Temperature -55°C...+180°C
Current carrying capability at RT 800 mA
Contact force at rec. OD 2,4 cN - 10,7 cN
Material compatibilities
Material compatibility 1 Gold
Material compatibility 2 Palladium
Material compatibility 3 Diverse
Material compatibility 4 Solder ball
Material compatibility 5 Aluminium
Material compatibility 6 Copper

Probe Card Service

Solutions that go well beyond the product. Learn more about our Probe Card Service.

FEINMETALL Probe Card Service