Adaptable to an enormous range of applications, the ViProbe® has been a proven buckling beam technology for more than 25 years, valued for its superior contacting quality and unique ease of repair.

Good contacts

Proven and excellent contacting quality

Temperature range

-55°C to 200°C


Best maintainability available on the market

is suitable for the following materials




you benefit from

In-house production

The ViProbe® is developed and manufactured internally at Feinmetall. This means that, in addition to the standard portfolio, solutions can be realized for any customer requirement.

Safe wafer testing

ViProbe® as Buckling Beam technology provides a nearly constant force in the working area, making it ideal for Pad Over Active Area applications.

Outstanding temperature behavior

ViProbe® has been used for decades as wafer test technology for automotive applications and is therefore optimized for high temperature differences.

Easy maintenance and service

The innovative "Free Beam Placement" process in combination with the round beam cross-section offers the best maintainability available on the market and thus reduces downtime to a minimum.

Specifications of the ViProbe® at a glance:

Min pitch of the DUTDown to 56 μm
Diameter of the contact elementDown to 1.6 mil
Max active areaUp to 80 mm x 80 mm
Capable temperature rangeFrom -55°C to 180°C
Current carrying capability at RTUp to 800 mA
Contact force at rec. ODFrom 2.6 cN to 10.8 cN

More information

An overview of our probe cards and further information can be found in our brochure Wafer Probe Cards.

Probe Card Types

Expert Advice from Feinmetall: The basis for your success


Probe Cards Overview

Find out more

Probe Card Service

Find out more