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Adaptable to an enormous range of applications, the ViProbe® is a proven buckling beam technology for more than 25 years, valued above all for its uniquely easy reparability.
New version of vertical contact technology with focus on increased service life and other advantages.
Probe card with lamella contact elements, especially suitable for RF applications with a high design variety.
Contacting WLCSP, SiP or flipchip wafers requires probe cards that can tolerate high currents while ensuring high signal integrity. The FeinProbe® addresses these applications perfectly.
Expert Advice from Feinmetall: The basis for your success
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FEINMETALL GmbH Zeppelinstrasse 8 71083 Herrenberg Germany
Phone: +49 7032 2001-0
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