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Home › Products › Product Finder › FeinProbe®
Semiconductor testing (WLCSP)

FeinProbe®

Probing WLCSP, SiP or flipchip wafers requires probes withstanding high current while simultaneously assuring high signal integrity. The FEINMETALL FeinProbe® addresses those applications with excellence.

Technical data

Specifications
Min. pitch of the DUT 150 µm
Min. diameter of the plunger 120 µm
Max. contact surface 80 mm x 80 mm
Temperature -40°C...+150°C
Current carrying capability at RT 2100 mA
Contact force at rec. OD 10 cN -18 cN
Bandwidth analog @ -1dB limit 100 GHz
Material compatibilities
Material compatibility 1 Gold
Material compatibility 2 Solder ball
Material compatibility 3 Copper

Probe Card Service

Solutions that go well beyond the product. Learn more about our Probe Card Service.

Discover our Probe Card Service
FEINMETALL Probe Card Service