Technical data
| Specifications | |
|---|---|
| Min. pitch of the test item | 150 µm |
| Minimum diameter of the contact element | 70 µm |
| Max. contact area | 80 mm x 80 mm |
| Temperature | -40°C...+150°C |
| Current carrying capacity at room temperature | 2100 mA |
| Contact force at recommended delivery | 4,5 cN - 15,1 cN |
| Bandwidth analog at -1dB limit | 100 GHz |
| Contact materials | |
|---|---|
| Contact material 1 | Gold |
| Contact material 2 | Solder ball |
| Contact material 3 | Copper |
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