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FEINMETALL MEMS probe cards are using latest production processes to obtain the solid MEMS beams used for contacting even smallest pitches in high-current applications. Compatibility with our well-established probe card setup is thereby guaranteed and ensures a reliable functionality. It is the optimal addition to our product range, especially developed to contact small pitch copper pillars and aluminum pads.


  • For fine pitch applications in high current and full array
  • Long-term position accuracy incl. shimming for M- & N-type
  • Reparability & exchangeability comparable to advanced FM technologies



MμProbe® - SOC

  • Connector: Hybrid Space Transformer
  • Head size: 30 mm x 30 mm
  • Pin count: 1 500
  • Number of DUT s: 9
  • Tester: Teradyne UltraFlex


MμProbe® - GPU

  • Connector: MLC Space Transformer
  • Head size: 40 mm x 40 mm
  • Pin count: 5 000
  • Number of DUT s: 4
  • Tester: Teradyne J750



Specifications at a glance

Contact elements: M, N for copper pillars and R, U for pads
Pitch: 80 μm array for copper pillars and 50 μm for pads
Beam count: more than 12 000
Active area: up to 100 mm x 100 mm
Temperature range: - 55 °C to 200 °C