Technical data
Specifications | |
---|---|
Min. pitch of the DUT | 60 µm |
Max. contact surface | 105 mm x 105 mm |
Temperature | -55°C...+180°C |
Current carrying capability at RT | 1300 mA |
Contact force at rec. OD | 1,4 cN - 3,8 cN |
Bandwidth analog @ -1dB limit | 100 GHz |
Material compatibilities | |
---|---|
Material compatibility 1 | Gold |
Material compatibility 2 | Palladium |
Material compatibility 3 | Diverse |
Material compatibility 4 | Solder ball |
Material compatibility 5 | Aluminium |
Material compatibility 6 | Copper |
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