Technical data
| Specifications | |
|---|---|
| Min. pitch of the test item | 60 µm |
| Max. contact area | 105 mm x 105 mm |
| Temperature | -55°C...+180°C |
| Current carrying capacity at room temperature | 1300 mA |
| Contact force at recommended delivery | 1,4 cN - 3,8 cN |
| Bandwidth analog at -1dB limit | 100 GHz |
| Contact materials | |
|---|---|
| Contact material 1 | Gold |
| Contact material 2 | Palladium |
| Contact material 3 | Diverse |
| Contact material 4 | Solder ball |
| Contact material 5 | Aluminium |
| Contact material 6 | Copper |
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