FEINMETALL
ViProbe^®

Adaptable to an enormous range of applications, the ViProbe® has been a proven buckling beam technology for more than 25 years, valued for its superior contacting quality and unique ease of repair.

Good contacts

Proven and excellent contacting quality

Temperature range

-55°C to 200°C

Maintenance

Best maintainability available on the market

FEINMETALL ViProbe^®
is suitable for the following materials

Pad

Pillar

Bump

Advantages,
you benefit from

In-house production

The ViProbe® is developed and manufactured internally at Feinmetall. This means that, in addition to the standard portfolio, solutions can be realized for any customer requirement.

Safe wafer testing

ViProbe® as Buckling Beam technology provides a nearly constant force in the working area, making it ideal for Pad Over Active Area applications.

Outstanding temperature behavior

ViProbe® has been used for decades as wafer test technology for automotive applications and is therefore optimized for high temperature differences.

Easy maintenance and service

The innovative "Free Beam Placement" process in combination with the round beam cross-section offers the best maintainability available on the market and thus reduces downtime to a minimum.

Specifications of the ViProbe® at a glance:

Min pitch of the DUT	Down to 56 μm
Diameter of the contact element	Down to 1.6 mil
Max active area	Up to 80 mm x 80 mm
Capable temperature range	From -55°C to 180°C
Current carrying capability at RT	Up to 800 mA
Contact force at rec. OD	From 2.6 cN to 10.8 cN