Axi (Automated X-Ray Inspection)
Axi (Automated X-Ray Inspection) is a non-destructive testing method for examining concealed structures within electronic assemblies. It is used in particular for components with invisible solder joints, such as ball grid arrays (BGA) or other fine-pitch housings. X-ray images can be used to detect internal solder joints, voids, bridges, or insufficient wetting that are not visible to the naked eye. AXI complements optical and electrical testing methods and is particularly indispensable where high reliability and process reliability are required.
FAQ
AXI is used to inspect concealed solder joints and internal structures of assemblies that are not visually accessible.
AXI is particularly necessary for components such as BGAs or QFNs, where visual inspection is not sufficient.
AXI enables non-destructive testing of internal structures and provides information on solder joint quality.
Further terms
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