Board testing
Board testing—also known as printed Circuit Board Testing —involves optical, electrical, and functional testing methods for quality control of printed circuit boards and assembled modules. The goal is to detect assembly errors, defective solder joints, open circuits, and functional deviations at an early stage and to ensure the long-term quality of the module.
For Circuit Board Testing, we offer all standard ICT and FCT test probes available on the market. In addition, our Progressive Series provides an innovative solution for challenging test conditions, such as high package densities, small pitch dimensions, or demanding contact requirements.
FAQ
ICT and FCT Contact Probes establish the electrical connection to the printed circuit board. They are crucial for reliable signal transmission and reproducible measurement results—especially at high package densities and small pitch sizes.
The quality of the contact directly influences measurement accuracy, reproducibility, and process stability. Precisely manufactured Contact Probes from FEINMETALL reduce measurement errors, contact problems, and unplanned downtime.
FEINMETALL offers high-precision contacting and testing solutions for technologically demanding industries where reliability, signal quality, and process reliability are crucial. Our products are used in the Automotive Industry and e-mobility (e.g., for control units, power electronics, and battery management systems), in industrial and power electronics, in Medical Technology, in Telecommunications, and in the field of energy and storage systems, among others. Our test probes ensure precise, stable, and long-lasting contact—even with high currents, high Frequencies, and demanding mechanical conditions.
Further terms
Any further questions?
Whether you have questions, suggestions, or requests, we are here to advise and support you.
