PCB testing
PCB testing encompasses electrical, functional, and optical testing methods used to inspect printed circuit boards in electronics manufacturing. Components, signal connections, and electrical properties are tested via defined test points to detect short circuits, open circuits, or malfunctions at an early stage.
Typical methods include In-Circuit Test (ICT), Functional Test (Fct), and Flying Probe Test. In addition, optical inspection methods such as AOI (Automated Optical Inspection) and AXI (Automated X-ray Inspection) are used. For complex assemblies or components that are difficult to access, Boundary Scan (Jtag) is also applied. The goal is to ensure reliable quality assurance and verify the electrical functionality of the assembly during the production process.
FAQ
Typical tests include In-Circuit Test (ICT) to check electrical parameters and Functional Test (Fct) to verify component functionality.
For high cycle counts, demanding mechanical conditions, or applications with increased requirements for lifetime and stability.
It enables the early identification of manufacturing and assembly defects and prevents costly rework or failures in the field.
Further terms
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