Package
Microchips and sensors are packaged in so-called packages in the Semiconductor Industry to protect them mechanically and make them electrically connectable. The package not only serves as protection against environmental influences such as moisture, dust, or mechanical stress, but also provides the electrical connection between the semiconductor chip and the printed circuit board. For this purpose, the package has defined contact surfaces or connection structures, such as solder balls, pins, or pads. These enable secure integration into electronic assemblies.
FAQ
Common designs are BGA (Ball Grid Array), QFN (Quad Flat No-Lead), QFP, and CSP.
The package protects the chip from environmental influences such as moisture, dust, and mechanical stress, and makes it easy to handle and solder.
They establish the electrical connection between the chip and the circuit board, e.g., via solder balls, pins, or pads.
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