FeinProbe®
FeinProbe® is a test card solution from FEINMETALL that combines Spring Contact Probes with test card technology to enable precise contact with bumps on WLCSP, SiP, and flip-chip wafers.
FeinProbe® was developed specifically for these wafer technologies and uses high-precision Spring Contact Probes that withstand high currents while ensuring high Signal integrity.
FAQ
FeinProbe® enables high-precision contacting, high Signal integrity, and reliable current transfer, even with very small structures.
Wafer testing requires high-precision Spring Contact Probes that reliably contact small contact areas while meeting high electrical requirements.
FeinProbe® is typically used in wafer probers and semiconductor test systems to electrically test chips while they are still on the wafer.
Further terms
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