Pad / Bond pad
A pad, or bond pad, is a defined metallic contact area on a semiconductor chip or printed circuit board that serves as an electrical interface for connections and test contacts.
On semiconductor chips, bond pads have applications for wire bonding as well as for contacting via probe cards during Wafer Testing. On printed circuit boards, pads serve as soldering or test areas for components and Test Fixtures.
The geometry, size, material, and surface finish of the pad significantly influence contact quality, transition resistance, and the reliability of the electrical connection.
FAQ
Bond pads are used to create electrical connections, e.g., through wire bonding, as well as for contacting during Wafer Testing using probe cards.
On printed circuit boards, pads serve as soldering areas for components or as test points for electrical testing.
Common problems include oxidation, contamination, mechanical wear, or improper geometry, which can lead to increased transition resistance or unstable contacts.
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