Wafer Testing
Wafer Testing refers to the electrical testing of semiconductor structures directly on the wafer before they are separated and further processed. The aim is to identify functional chips at an early stage and optimize yield.
Our Fine Pitch Contact Probes are used in Wafer Testing in Probe Cards. Integrated into the test head, they ensure precise, reproducible contacts and contribute significantly to maximizing our customers' yield.
FAQ
They establish precise contact with the pads on the wafer in the Probe Card and enable stable, repeatable measurements.
Typical test parameters include functionality, leakage currents, resistances, capacitances, Radio Frequency and logic functions, depending on the component type.
It identifies faulty chips at an early stage, thereby increasing efficiency and yield in the further manufacturing process.
Further terms
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