Osp Coating
The Osp Coating is an organic protective layer applied to copper traces on printed circuit boards that protects against oxidation and ensures solderability.
In test technology, particularly in In-Circuit Test (ICT) and Functional Test (Fct), the Osp Coating poses special challenges for contacting, as the insulating protective layer makes establishing a stable electrical connection difficult and must be specifically penetrated.
Suitable Contact Probes with an adapted Tip style, coating, and Contact force are therefore crucial to ensuring reliable contact and reproducible measurement results. Specially designed Contact Probe series, such as Progressive Series solutions, enable improved penetration of the protective layer and stable contact conditions even under demanding test conditions.
FAQ
An Osp Coating is an organic protective layer applied to copper traces that prevents oxidation and ensures solderability.
Contact probes must have a suitable tip style, plating, and contact force to reliably penetrate the OSP layer.
Specialized contact pin solutions, such as the Progressive Series, enable reliable penetration and stable contact even on OSP-coated printed circuit boards.
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