Flux is an auxiliary material used in the soldering process. It is used to reduce oxide layers on metal surfaces, improve wetting by the solder, and ensure a reliable solder joint.
After soldering, flux residues may remain on solder joints, contact points, or PCB surfaces. These residues can be sticky, adhere to the tip of a Contact Probe, and make electrical contact testing on the PCB more difficult.
Flux and its residues are particularly relevant in lead-free soldering processes, as higher soldering temperatures, harder solder joints, and oxide formation can create more challenging contact conditions. Suitable Contact Probes, Tip styles, coatings, and spring preloads help penetrate such residues and establish a stable electrical connection.
FAQ
"Flux" is the English term for a flux, an auxiliary material used in the soldering process.
Flux aids in wetting metallic surfaces and helps reduce oxide layers during the soldering process.
They can adhere to the contact tip, cover the contact surface, and lead to increased transition resistance or unstable measurement results.
Further terms
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