Spring Preload
Spring preload refers to the mechanical preload of a spring within a Contact Probe. It ensures that a defined force acts on the contact tip right from the start of the contact process.
In printed circuit board testing, spring preload influences how reliably a Test Point, solder joint, or contact point is electrically connected. Especially in the presence of contaminated surfaces, flux residues, or oxide layers, an appropriate spring preload can help ensure more reliable contact.
In the Progressive Series contact probes, increased spring preload is combined with suitable tip styles and a special coating. This allows for better simulation of demanding contact conditions in ICT and the Functional Test.
FAQ
Spring preload refers to the force with which the spring in the Contact Probe is preloaded even before the stroke is complete.
Appropriate spring preload can help penetrate residues or oxide layers more effectively and stabilize the electrical connection.
The Progressive Series combines increased spring preload with suitable tip styles and a special coating to better handle demanding contact conditions.
Further terms
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