Tin Diffusion
Tin diffusion describes the penetration or incorporation of tin into adjacent material layers, such as at the tip of a Contact Probe. It can occur when a Contact Probe repeatedly comes into contact with tin-containing solder joints.
In printed circuit board testing, tin diffusion can alter the surface of the contact tip. This can increase electrical resistance, degrade contact quality, and reduce the service life of the Contact Probe.
Selecting an appropriate coating is particularly important for solder-based contacting. Durable coatings and suitable tip styles help protect the contact tip and ensure a reliable electrical connection even under demanding test conditions.
FAQ
Tin diffusion describes the penetration or deposition of tin into adjacent material layers, for example at the tip of a Contact Probe.
Tin diffusion can lead to higher resistance, poorer contact quality, and a shorter service life of the Contact Probe.
In solder contact, the contact tip comes into direct contact with tin-containing solder pads. This increases the importance of the coating, tip style, and contact force.
Further terms
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