Flux residue
Flux residue is a residue from the soldering process that can remain on printed circuit boards, solder joints, or contact points. It is produced by the flux used and can vary in severity depending on the soldering method, material, and cleaning process.
During PCB testing, flux residue can interfere with electrical contact. It can accumulate on the surface of the contact point, stress the contact tip, and lead to increased transition resistance or unstable measurement results.
Particularly in lead-free soldering processes, flux residues can be more stubborn and place higher demands on Contact Probes, Tip styles, coatings, and spring preload. A suitable contact solution helps penetrate residues and establish a reliable electrical connection.
FAQ
Flux residue is a residue of flux that may remain on printed circuit boards, solder joints, or contact points after soldering.
Flux residue can contaminate the contact tip, subject it to mechanical stress, and make it difficult to maintain reliable contact over many test cycles.
Lead-free soldering processes can result in harder residues and thicker oxide layers, which must be reliably penetrated by Contact Probes.
Further terms
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