Solder Contact / Solder Pad Contact
Solder pad contact, also known as solder point contact, refers to the electrical connection of solder pads on a printed circuit board. In this process, the contact tip of a Contact Probe makes direct contact with a soldered contact point to reliably transmit electrical signals for ICT or Functional Test.
In printed circuit board testing, solder pad contacting can be challenging because solder pads may be compromised by flux residues, oxide layers, dust, or other contaminants. Such residues can make contacting difficult and lead to increased transition resistance or unstable measurement results.
Suitable probe tip styles, coatings, and appropriate spring preload are crucial for reliable solder pad contact. They help penetrate residues, reliably reach the contact point, and establish a stable electrical connection.
FAQ
In solder pad testing, contact is made directly to a solder pad. Test point contact may also include specially designated test pads or other contact areas on the printed circuit board.
Solder joints can be compromised by flux residues, oxide layers, or contaminants. As a result, the contact tip must penetrate the surface reliably to establish a stable electrical connection.
Contact probes must have a suitable Tip style, appropriate spring preload, and a durable coating to ensure reliable and repeatable contact with solder joints.
Further terms
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