Penetration behavior
Penetration behavior describes the ability of a contact tip to mechanically penetrate surface layers on test or solder points. These include, for example, flux residues, oxide layers, solder residues, or other contaminants that can hinder electrical contact.
In printed circuit board testing, good penetration performance is essential to ensure that the Contact Probe reliably reaches the conductive contact point. Key factors include the tip style, Contact force, spring preload, coating, and the condition of the contact point.
Under demanding test conditions, optimized penetration performance can help reduce increased transition resistance, faulty contacts, and unnecessary retests.
FAQ
Penetration performance describes how well a contact tip can penetrate residues or surface layers on a test or solder point.
Important factors include tip style, contact force, spring preload, coating, surface material, and type of contamination.
Appropriate tip styles, durable coatings, and proper spring preload help the tool penetrate residues more effectively.
Further terms
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