Contamination
Contamination refers to the soiling of surfaces by foreign substances such as dust, grease, oils, fingerprints, lubricant films, solder paste, adhesives, flux residues, or oxidation. In printed circuit board testing, it primarily affects test and solder points, contact points, and the contact tips of Contact Probes.
Contamination can hinder electrical contact because it covers the conductive surface or adheres to the contact tip. This can result in increased transition resistance, unstable measurement results, or contact-related test failures.
For reliable testing processes, Contact Probes must be able to reliably penetrate or bypass such contaminants. Appropriate Tip styles, durable coatings, and suitable spring preload ensure stable contact even under challenging surface conditions.
FAQ
Typical causes include dust, grease, fingerprints, oils, lubricant films, solder pastes, adhesives, flux residues, or oxidation.
Appropriate tip styles, durable coatings, and proper spring preload help penetrate contaminants and stabilize contact quality.
Contaminants can adhere to the contact tip, cover the contact surface, and increase the transition resistance.
Further terms
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