Progressive Contact Probe
A Progressive Contact Probe is a Contact Probe from the Progressive Series designed for demanding contact conditions in printed circuit board testing. It is used when it is difficult to establish a reliable connection to a Test Point or solder pad due to flux residues, oxide layers, OSP coatings, or other contaminants.
Technically, the Progressive Contact Probe combines a durable Progressive coating, increased spring preload, and suitable tip styles. This allows the contact tip to better penetrate residues, establish a stable electrical connection, and maintain contact quality over many touchdowns.
In ICT and Functional Test, a progressive Contact Probe helps reduce contact-related measurement errors, improve service life, and enable stable testing processes under difficult conditions.
FAQ
It is used when solder joints or contact points are difficult to make contact with due to residues, oxide layers, OSP coatings, or contamination.
It combines a progressive coating, increased spring preload, and appropriate tip styles to reliably reach challenging contact points.
A progressive Contact Probe is designed for more challenging contact conditions and combines a progressive coating, increased spring preload, and optimized Tip styles to make more reliable contact with contaminated or oxidized contact points.
Further terms
Any further questions?
Whether you have questions, suggestions, or requests, we are here to advise and support you.
