Lead-Free Soldering
Lead-free soldering refers to a soldering process that does not use lead in the solder. In printed circuit board manufacturing, this process is used to meet legal and environmental requirements and to produce lead-free electronic assemblies.
For printed circuit board testing, lead-free soldering can create more challenging contact conditions. Higher soldering temperatures, harder solder joints, oxide layers, and flux residues can make it more difficult to establish reliable contact with test or solder points.
Contact probes must be able to reliably reach such surfaces and penetrate any residues. Appropriate Contact Probe tip styles, plating, and suitable spring preload support stable electrical contact with lead-free solder joints.
FAQ
Lead-free soldering refers to a soldering process in which lead-free solder materials are applied to manufacture electronic assemblies without lead.
Contact probes must reliably penetrate harder surfaces, flux residues, and oxide layers without significantly compromising contact quality or service life.
Appropriate tip styles, special coatings, and the right spring preload help penetrate residues and oxide layers to create a stable bond.
Further terms
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