HP spring
An HP spring is a spring with increased preload within a Contact Probe. It ensures that the contact tip applies a defined higher force to the Test Point, solder joint, or contact point right from the start of the contact process.
In printed circuit board testing, an HP spring can be particularly helpful under challenging contact conditions. These include contaminated solder joints, flux residues, oxide layers, or hard surfaces that can make reliable electrical contact difficult.
In the Progressive Series, the HP spring is combined with Progressive Coating and suitable tip styles. This allows the contact tip to penetrate residues more reliably and support a stable electrical connection under difficult test conditions.
FAQ
An HP spring is a spring with increased preload that is used in Contact Probes to guide the contact tip onto the Test Point with a defined force.
In the case of flux residues, oxide layers, or contaminants, the higher bias voltage can help penetrate the surface more reliably.
An HP spring can help ensure stable contact, fewer miscontacts, and more reliable test procedures at difficult contact points.
Further terms
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