FPY Optimization
FPY optimization refers to measures taken to improve first-pass yield—that is, the percentage of test specimens that successfully pass a test process on the first attempt. The goal is to reduce retests, measurement errors, and unnecessary process steps.
In printed circuit board testing, first-pass yield depends heavily on reliable contact. Contaminated solder joints, flux residues, oxide layers, or increased transition resistance can cause otherwise defect-free assemblies to not be immediately recognized as passing.
FPY optimization can be supported by using appropriate Contact Probes, suitable Tip styles, stable Contact force, durable coatings, and a process-reliable test environment. This makes test procedures more efficient and improves the quality of the measurement results.
FAQ
FPY optimization refers to measures that increase the percentage of test subjects who successfully pass a test process on the first attempt.
Contamination, oxide layers, improper Contact force, wear, or damaged contact surfaces can increase the transition resistance.
A stable connection helps prevent measurement errors caused by contact problems, contamination, or increased transition resistance.
Further terms
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