Solder paste
Solder paste is a paste-like material used in printed circuit board (PCB) manufacturing to connect electronic components to PCBs. It typically consists of fine solder particles and flux components and is applied to the designated contact areas prior to the soldering process.
After soldering, residues of solder paste, flux, or other process materials may remain on solder joints and contact points. These residues can complicate electrical contact during PCB testing, as they may cover the contact surface or adhere to the contact tip.
Therefore, suitable Contact Probes, appropriate Tip styles, durable coatings, and a defined spring preload are essential for reliable contact with solder joints. These elements help penetrate residues and establish a stable electrical connection to the Test Point.
FAQ
After the soldering process, residues may remain on solder joints or contact points, making electrical contact difficult.
They can cover the contact surface, adhere to the contact tip, and lead to increased transition resistance or unstable measurement results.
With the appropriate contact force, suitable Tip style, high-quality coating, and clean contact surfaces, the transition resistance can be kept stable.
Appropriate tip styles, durable coatings, and suitable spring preload help penetrate residues and stabilize contact quality.
Further terms
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